The Evolution of CPO (Co-Optics): Redefining GPU to GPU communication

The Evolution of CPO (Co-Optics): Redefining GPU to GPU communication

As the VP of Strategy at Micas, I’ve witnessed the remarkable journey of CPO—from early research breakthroughs to today’s high-capacity data centers. Now, we stand on the brink of another pivotal transition: “co-optics,” a paradigm where optics and electronics are merged within the same package to overcome performance bottlenecks imposed by traditional copper interconnects. By reducing signal loss, latency, and power consumption, co-optics is rapidly becoming the must-have technology for high-performance computing and next-generation networks.

1. The 1980s: The Conceptual Birth of Silicon Photonics Laid the Foundation of Integrating photonic with standard Semi Processes

2. The 1990s: Waveguide Innovations and Prototype Systems

Waveguides are critical for routing light signals. Overcoming early challenges—such as high propagation losses—validated that photons could be guided effectively on silicon substrates.

3. The 2000s: Commercialization and Data Center Adoption

Cisco integrated optical solutions into networking gear, while Broadcom acquired and developed optical transceiver technologies. During this time, TSMC refined its semiconductor fabrication processes, paving the way for large-scale silicon photonics manufacturing.

4. The 2010s: High-Performance Computing and Advanced Integration

HPC and AI platforms adopted silicon photonics for node-to-node connections. NVIDIA, began exploring photonic interconnects to optimize data flow in AI clusters. Meanwhile, Intel unveiled transceivers that integrated lasers and modulators on a single chip

5. The Present: Co-Optics Leading the Way

By placing lasers, modulators, and processors in one package, the distance between electrical and optical interfaces shrinks dramatically, boosting throughput and energy efficiency. TSMC’s advanced packaging co-packaged designs are becoming a reality thanks to sophisticated foundry technologies like chip-on-wafer-on-substrate (CoWoS) and fan-out packaging.

Looking Ahead: From Incremental to Transformational

At Micas, we partner with industry leaders Broadcom to develop next-generation technology that exceeds today’s performance and energy requirements.

Co-optics addresses fundamental bottlenecks by merging optical and electronic components into a single cohesive unit. It’s particularly critical for modern applications like large-scale AI training and inferencing all of which demand low latency and high bandwidth. Expect further advancements in waveguide design, on-chip laser integration, and thermal management as the industry races to meet these needs.

As these technologies mature, we’ll continue sharing insights and illustrating how co-optics solutions make its way into AI data centers. The future is bright for CPO, we’re just getting started.