The core technology behind Co-Packaged Optics (CPO) is deep integration of optics and electronics. By integrating both the ASIC and optical engine onto a single ASIC chip, In the CPO system, the DSPs in traditional optical transceivers are no longer required, significantly reducing power consumption. In traditional systems, optical transceivers are independently installed in switch ports. Optical signals are converted into electrical signals before being transmitted to the switching chip. This design works well for low-speed transmission. However, as data center bandwidth and speed demands have exploded, the multi-step conversion process becomes less efficient, leading to high power consumption, increased signal delay, and larger device sizes.
CPO switches aim to overcome these challenges. By packaging both the optical engine and the switching chip, CPO enables optical signals to be converted directly within the chip, eliminating the need for high speed PCB signal routing.
CPO switches reduce power by over 50% compared to traditional switches of the same specifications.
Unlike traditional pluggable switches, CPO switches do not require optical transceivers,
resulting in lower procurement costs.
CPO switches help improve the efficiency of GPU computing power utilization by maintaining low latency.
Using TC to test the latency of a single port, we obtain the following results.
CPO switches offer chip-level reliability through rigorous testing.
Component | Reliability Result | Status |
---|---|---|
![]() Laser
|
•Over four million lasers have been shipped since 2016. •100 x 109 device hours in the field •Failure rate < 0.1 FIT |
Qualified |
![]() Pluggable Laser Source (PLS)
|
•All qualification tests are complete and have passed. | Qualified |
![]() Photonic IC (PIC)
|
•All qualification tests are complete and have passed. | Qualified |
![]() Optical Connector
|
•All qualification tests are complete and have passed. | Qualified |